metallization
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n.
敷金属（法），镀金属（法）；金属化；
双语例句
用作名词(n.)
The development trends of plastic metallization were pointed out.
指出了塑料金属化今后的发展趋势。
A method of surface metallization of diamond, temper powder diffusion heat treatment, was developed.
研究粉末扩散法使金刚石表面金属化的工艺。
权威例句
Directed DNA metallization.DNA as a Selective Metallization Template
Copper Metallization for High Performance Silicon Technology
Electrochemical metallization memories--fundamentals, applications, prospects
Process for hillock control in thin film metallization
Electromigration failure modes in aluminum metallization for semiconductor devices
Study of Multilevel Programming in Programmable Metallization Cell (PMC) Memory
ULTRATHIN DIFFUSION BARRIERS/LINERS FOR GIGASCALE COPPER METALLIZATION
Relationship between interfacial adhesion and electromigration in Cu metallization
Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
1. Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
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2. The wetting of diamond by three kinds of liquid alloy and its surface metallization by means of solid contact techniques were systematically studied.
本文较系统地研究了三类液态合金对金刚石的润湿和固相接触法实现的金刚石表面金属化。
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3. It is found that the stepcoverage is improved with the increase of temperature by using barrier layer and silicides in the aluminum metallization process of a sub|micron IC device.
在亚微米IC器件的铝金属化工艺中，采用了阻挡层和硅化物后，发现随着铝淀积温度的升高，铝的阶梯覆盖率有所提高。
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4. The relationship between metallization rate and reducibility is analyzed based onthe definitions of them.
根据金属化率和还原度的定义，分析了二者之间的关系。
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5. This paper introduces a method of producing metallization pellet with laterite nickel ore as raw material and coal as a reductant in car bottom continuous furnace.
介绍了一种利用台车连续炉，以红土镍矿为原料，煤粉为还原剂，生产镍铁金属化球团的方法。
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6. In this paper, the close relation between the change of material for the device CS50backside metallization & technology improvement and reliability are briefly described in the design.
本文简要的说明了CS50在开发过程中，其背面金属化材料的更改，工艺优化都与可靠性有着密切联系。
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7. The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
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8. Electroless plating processes for surface metallization of plastics, such as ABS, polypropylene (PP), polystyrene (PS) and polyvinyl chloride (PVC) were introduced.
介绍了ABS、聚丙烯、聚苯乙烯、聚氯乙烯等塑料的化学镀表面金属化工艺。
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9. The result shows that it has high strengths and metallization rate when the water glass is used as additive.
结果表明，以水玻璃为粘结剂的含碳球团具有较好的强度和金属化率。
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10. The company is a world leader in the sophisticated technologies of metallization and ceramic-to-metal assembly.
该公司在材料金属化处理和金属——陶瓷组装技术方面，在全球居领先地位。
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11. The technology applied successfully in the production of the metallization for insulated porcelain sleeve on the surface of the power capacitor.
此项研究技术已用于电力电容器绝缘瓷套表面金属化的实际生产中。
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12. The bonding between diamond and many substrates may be realized through the metallization of diamond surface. An effective method is to coat diamond with carbide forming metal, titanium.
金刚石表面金属化可以实现金刚石与许多材料之间的结合，在金刚石表面镀覆金属钛是使金刚石表面金属化的重要手段。
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13. Furthermore, the model of the metallization of diamond surface and technical process have been put forward.
进一步提出了金刚石表面金属化的模型和技术途径。
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14. The Fe content, metallization and iron recovery of the product are 90%, 92% and over 84%, respectively.
所得产品的铁品位、金属化率和铁回收率分别在90％、92％和84％以上。
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15. Quick surface metallization of titania powder was carried out by electroless chemical deposition of nickel.
采用镍的无电子化学沉积方法研究了纳米二氧化钛粉末表面的快速金属化。
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16. In this paper, we focus on the research and the new development of the copper metallization and the diffusion barriers.
本文介绍了大马士革工艺中铜金属化以及阻挡层的研究现状。
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17. A method of surface metallization of diamond, temper powder diffusion heat treatment, was developed.
研究粉末扩散法使金刚石表面金属化的工艺。
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18. The skewbald of the ceramic metallization during production are analyzed, the reasons are investigated. Several improvement measures are proposed.
对生产过程中出现的金属化瓷件内花斑现象进行了分析，探讨了形成的原因，并提出了一些改进措施。
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19. Continuous car type furnace was used in iron ore reduction successfully. The contents of with rotary hearth furnace are as more than 92% metallization and about 90% total iron.
此炉子已经成功地用于铁精矿粉还原焙烧，所得到的海绵铁产品的金属化率大于92 % ，全铁约90 %。
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20. The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors.
电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。
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21. It is not like the conventional plating on plastic, the metallization selectivity is very important for 3D-MID Product, which depend on people experience and skill a lot.
不同于传统的塑料表面处理，3D-MID对金属化的选择性要求非常高，技术上有很高的难度。
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22. The study shows the whole process of metallization of silk fabric by hydric plasma, and all kinds of experiment conditions that influence the result.
研究了应用低压氢气等离子体对真丝纤维进行金属化处理。
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23. In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
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24. Sapphire and Nb alloy have been successfully brazed by use of tungsten-metallization technique.
通过对蓝宝石的钨金属化，实现了蓝宝石与铌合金的高温封接。
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25. There were many ways to achieve metallization of quartz optical fiber surface, and electroless plating was obviously superior to other methods.
石英光纤表面金属化有多种方法可以实现，化学镀的方法明显优于其他方法。
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26. The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
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27. The metallization process was studied. The interface phenomena and combined mechanism of metallization film were studied with the help of XPS, XRD and SEM analyses.
探讨了金属化的工艺条件，运用XPS，XRD，SEM等现代分析技术研究了界面现象及粘附机理。
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28. In the study of thin-film conductors, ion diffusion is an important phenomenon as electrodiffusion degradation can lead to metallization failure.
在薄层导体的研究中，粒子的扩散是一类重要的现象，由于电扩散的降解能导致金属的毁坏。
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29. In the study of thin-film conductors, ion diffusion is an important phenomenon as electrodiffusion degradation can lead to metallization failure.
在薄层导体的研究中，粒子的扩散是一类重要的现象，由于电扩散的降解能导致金属的毁坏。
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30. aluminum metallization
铝金属化
-- 来源 -- 英汉 - 翻译参考[网络]
31. metallization interconnection technology
金属互连工艺
-- 来源 -- 英汉 - 短句参考
32. metallization patter
金属化互连图
-- 来源 -- 英汉 - 翻译参考[网络]
33. fixed pattern metallization
固定图案金属化
-- 来源 -- 英汉 - 翻译参考[网络]
34. single layer metallization
单层金属化
-- 来源 -- 英汉 - 翻译参考[网络]
35. refractory metallization
耐熔金属化
-- 来源 -- 英汉 - 翻译参考[网络]
36. silicide metallization
硅化物金属化
-- 来源 -- 英汉 - 翻译参考[网络]
37. equipotential metallization
等电位金属化
-- 来源 -- 英汉 - 翻译参考[网络]
38. second metallization
第二次金属化
-- 来源 -- 英汉 - 翻译参考[网络]
39. interlayer metallization
层间金属化
-- 来源 -- 英汉 - 翻译参考[网络]
metallization
